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Fonekong Solder Paste 183°
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Fonekong Solder Paste 183°

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Fonekong Solder Paste 183° buy from www.gsm24seven.com.

Rs.299.00 Rs.399.00

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Fonekong Solder Paste 183°

DESCRIPTION:
Temperature: 183℃ FONEKONG
It can be used for rework, sphere or pin attachment to BGA, PGA and CSP packages, and assemble operations such as Flip Chip attachment to PWB substrates. It is a necessary and helpful tool in BGA reballing.
Feature :
  • Excellent capacity of solder-stickiness
  • Excellent Anti-wet Capacity
  • Widely used on BGA, PGA, CSP packages and flip chip operation
  • Suitable for multiple PCB reflow
  • No-clean and Lead free for environmental protection
SKU: FONEKONG Categories: , ,
Weight 0.100 kg
Dimensions 8 × 5 × 5 cm
Weight 0.040 kg
Color As picture shown
Size Approx. 1.30*1.30*1.14inch / 3.3*3.2*2.9cm
Type XG50
Alloy Sn63/Pb37
Microns 25-45um
Material Plastic +solder paste

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