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The packing list includes 4 pieces of knife and 1 knife handle
* Model S: Separate the CPU and Nand flash
* Model E: Mobile phone motherboard IC CPU glue removal
* Model X: Professional edge glue removal tool
* Model Y: Cut the underfill black glue without hurting the motherboard.
* Place the desoldering wick over the solder to be removed, then push the heated soldering iron tip onto the desoldering wick.
* The solder will be absorbed. Remove the desoldering wick after the solder has been absorbed.
* Cut off the used section of the wick using nippers.
* Our thin and soft desoldering wire flat braid has efficient thermal transmission.
* Removes solder faster with better heat response than previous wicks.
* Recommended for lead-free solder with the high heating load.
* RMA base flux. High-quality desoldering wick with braided copper wire, saturated with non-chlorine special flux.
* Can be used for precision PCBs safely.
• 320W high power supply, support unlimited function expansion
• Built-in bluetooth WiFi chip, remote software upgrade by iCloud, more convenient
• Type-A/Type-C fast charge output, support PD/QC fast charge protocols
• 60W maximum charging power for single channel, 30W maximum charging power for dual channel
• Including iPhone 6-14 battery protocols, boot up the motherboard of mobile phone with one click for testing
• 3.0inch IPS full view high definition screen, 32V/8A design
•Customized three-channel current and voltage shortcut setting, adjust current and voltage parameters with one click
• Current collection is precise to 0.1mA, switch curve or pointer display models at will
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